Semiconductor Packaging News
A research team led by Hyeong-U Kim at KIMM has achieved a world-first: fabricating 4-inch heterostructure semiconductors using PECVD technology. This innovation enables low-power, high-performance AI semiconductors, enhancing efficiency & …
Semiconductor Packaging News
Advanced Packaging Driving New Collaboration Across Supply Chain. The semiconductor industry's shift to advanced packaging, including chiplets and heterogeneous integration, fuels innovations in AI, 5G, and automotive fields. Industry leaders stress that collaboration is crucial to meet performance demands and tackle complex challenges.
Semiconductor Packaging News Index
Although House Speaker Johnson initially suggested ... CNBC. Nov 8, 2024. SUMMARY. Semiconductor firms ASML, AMD, Qualcomm reaffirm China commitment at CIIE trade fair. At Shanghai's CIIE trade fair, global semiconductor giants like ASML, AMD, and Qualcomm showcased advanced tech products, reaffirming their commitment ... South China Morning Post.
Semiconductor Packaging News
October 31, 2024. Back-end Semiconductor Equipment: Advanced Packaging to Propel the Market. The back-end semiconductor equipment market, essential for assembly and packaging, is set to grow in 2025, driven by AI investments and advanced packaging demands. Despite recent declines, revenue should rebound as AI and high-performance computing ...
Semiconductor Packaging News
A research team led by Hyeong-U Kim at KIMM has achieved a world-first: fabricating 4-inch heterostructure semiconductors using PECVD technology. This innovation enables low-power, high-performance AI semiconductors, enhancing efficiency & …
Worldwide Silicon Wafer Shipments Increase 6% in Q3
Worldwide Silicon Wafer Shipments Increase 6% in Q3. Silicon wafer shipments grew 5.9% in Q3 2024 to 3,214 million square inches, with annual growth of 6.8%, driven by strong AI demand. SEMI SMG forecasts continued growth into 2025, though below 2022 peak levels. The dedicated team at Semiconductor Packaging News has provided this summary for ...
Semiconductor Packaging News
Game-Changing Solutions for Power Module and Semiconductor Production with Plasma Technology Plasmatreat GmbH is excited to announce its first participation at the electronica and SEMICON Europa in hall C5 at booth 169.
Funding Competition for Up to $1.6 Billion to Accelerate U.S ...
The Biden-Harris Administration announced a $1.6 billion funding opportunity under the CHIPS and Science Act to boost advanced semiconductor packaging in the U.S. This investment aims to enhance performance and competitiveness in microelectronics, addressing key …
CHIPS Subsidy Boosts Advanced Packaging in U.S.
A $1.6 billion CHIPS Act subsidy aims to boost U.S. advanced-packaging capacity. Taiwan's ASE and others double California capacity to support AMD, Apple, and Nvidia. The U.S. Department of Commerce launches a competition to spur R&D in energy-efficient tech. The dedicated team at Semiconductor Packaging News has provided this summary for your ...
Intel Glass Core Substrate Update - Semiconductor Packaging News
Intel Glass Core Substrate Update. INEMI hosted a webinar spotlighting Glass Substrates for Advanced Packaging, showcasing Intel's pioneering work. Dr. Dilan Seneviratne and Dr. Gang Duan of Intel detailed the company's strategic focus on glass core substrates, integral to their Advanced Packaging roadmap unveiled in September 2023.